Neuralink Turns to Samsung for Next-Gen Implant Chip
Summary
Samsung Electronics has begun developing Neuralink's fourth-generation implant chip, a custom processor for brain-computer interfaces. Built on Samsung Foundry's 4nm process, test chips are expected in the first half of 2027 with mass production possible in the second half. This represents Samsung's first order from Neuralink, which previously relied on TSMC. The deal follows a larger $16.5 billion Tesla chip agreement with Samsung in 2025. South Korea has designated BCIs as part of its K-Moonshot strategy, with plans for mission-oriented projects from 2027 across invasive implants, non-invasive wearables, and neural-signal decoding.
Why it matters
Neuralink's partnership with Samsung for next-generation chip fabrication marks a significant maturation of their supply chain and signals confidence in high-volume manufacturing. Custom silicon is the critical enabler for scaling electrode counts beyond 1,000 and improving signal resolution without increasing implant size.
Want the full NeurotechMag Pro intelligence database?
Access 800+ papers, trials, patents, funding rounds and news items — updated daily.
Start free trial