Patent Filing
High density neural implant cylindrical packaging
Neuralink4/2/2024·04/02/24🌐 USA
Summary
A robust, hermetically sealed cylindrical housing enclosure framework designed specifically to protect microfabricated neural interface electronics from the corrosive, saline environments of biological tissue while maintaining a minimal cranial footprint.
Why it matters
Ensures structural survival and electrical insulation for the implanted processing unit without relying on bulky, non-biocompatible enclosures.
#BCI#Electrode Technology#Neural Interfaces#Neurostimulation
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